The new head office building and Osaka factory were completed in May, 2004. The latest molding machines are installed within the airy and clean factory, which incorporates a formidable production system and an expertly skilled workforce, key to our global competitiveness in world markets. We shall also stop at nothing to ensure maintenance of product quality.
In addition to our final production process, labelling and packaging operations take place in a perfectly clean room, screening out dust even of micron size.

Based on technologies accumulated by experienced engineers for many years, GOLD INDUSTRIES' Plant No. 2 develops and manufactures shipping containers of silicon wafers and compound wafers that are indispensable to semiconductor business. Furthermore, GOLD INDUSTRIES provides highly airtight and clean shipping containers for the transportation of LCD boards.